S3 Tri-combo Gen 2

S3 Tri‑combo Gen 2

Compact, expandable 4K60p Event Master processor

S3 Tri‑combo Gen 2

Compact, expandable 4K60p Event Master processor

The updated S3 Tri-combo Gen 2 configuration features all Generation 2 input and output cards adding more 4K60 capacity over a single cable while retaining its segment leading fourteen ins and fourteen outs from the previous configurations. Under the hood it boasts the same processing features, image quality, flexibility and durability as the whole Event Master Family. It comes with the unique feature of expansion linking including its actual link.

In short: all the tools you need to create a stunning live experience, in a single compact and roadworthy housing.

Powerful features, easy operation

  • Pre-loaded with six I/O cards
  • Interlinking of S3-4K chassis allows expansion of inputs, outputs or layers
  • Manage all version of the system with the cross-platform Event Master Toolset
  • Serviceable in the field and ready for future signal interfaces
  • Optional redundant power supplies for maximum peace of mind
  • Projection blend and Native Test Pattern support
  • LED Custom format and Native Test Pattern support

Specifications

Download spec sheet
General specifications
Model
NGS-3U
Live effects canvas
Up to 20 megapixels in PVW/PGM or 40 megapixels in PGM only mode
Video inputs
14 FHD@60 inputs via 3 input cards (DP1.2 and HDMI 2.0 4 inputs ea, Tri-combo 6 inputs)
  • Mix and match between 14 x FHD@60 to 5x 4K inputs ( 1 x 4K60 over Slot 1, 2 x 4K@60p all other slots)
  • 4x SD/HD/3G/6G/12G SDI connectors (Tri-Combo card)
  • 5x HDMI 2.0 (550 MHz max)
  • 5x DisplayPort 1.2 (600 MHz max)
Video outputs
14x FHD@60 /12x 4K@30 / 6x 4K@60 outputs via 3 output cards (HDMI 2.0 4 outputs ea, Tri-combo 6 outputs)
  • 4x SD/HD/3G/6G/12G SDI connectors (Tri-Combo card)
  • Multiviewer 4x HDMI 2.0 for 4x FHD@60 or 1 x 4K60 (600MHz max)
  • 4x HDMI 2.0 when used as standard output card
Genlock
Analog reference input/loop on BNC connectors; bi-level and blackburst at SD and tri-level at HD
S3D Sync: 4x input Din connector, 2x output Din connector
Program output
Up to 8 program outputs with mixing bakground and pip/key, configurable as single screens or tiled/blended widescreens (preview and Multi-Viewer not available in all configurations)
Configurable for up to 14x 2048X1200@60 or up to 6x 4096x2400@60
Independent edge blending/feathering control for all four sides 
Scaled Aux outputs
Route and Scale any source to any Auxilliary output
User definable for up to 14X 2048X1200@60 / 12 x 4K@30 / 6 x 4096x2400@60
All outputs can be defined as Aux destinations for a total of 14 Aux outputs
Output color correction. (preview and Multi-Viewer not available in all configurations)
Upscale any source to any Super AUX array of screens
Mixers
  • Native resolution background mixer per output screen
  • Independent layer transitions or full Preview/Program transition
  • Flexible layer allocation – 4 mixable or 8 single scalable PIP/key layers assignable to any Program output screens
Still stores
Up to 100 HD or 25 UHD, depending on the import file size.
Layer effects
  • Borders (hard, soft, halo) and drop shadows
  • Color effects
  • Strobe, H&V flip
  • Luma, chroma and Cut/Fill keys (not all modes support keying)
  • PIP moves via Keyframes
Multiviewer
  • Flexible user-definable layouts
  • Monitor all Inputs and Outputs, including Preview and Aux
  • 4 x FHD@60 outputs or 1 x 4K60
  • Dedicated hardware same as E2 Gen2 Event Master Processor
  • Source On Pvw/Pgm Indication in MVR
  • Source on PVW/PGM reflected in the operation view
  • Source on PVW/PGM available via TSL3.1 on network
Expandability
Easily expandable for larger display applications via proprietary links
Link units to increase available Inputs and Outputs for larger tiled/blended widescreen applications
Expansion via simple linking to: 1x E2 or 4x EX chassis, or up to 7 more S3-4K chassis
S3-4K ships with the ability to link 8 chassis for expansion
S3-4K TriCombo Gen 2 is a S3 chassis with only Gen 2 I/O cards
HDCP
HDCP compliance determined by installed cards.
Control
  • Event Master screen management software for PC or MAC
  • Event Master Controllers
  • WebUI
  • JSON and Telnet API available
  • Ethernet RJ-45, 1000/100/10 Mbps autosense
Serviceability
  • Field-Serviceable I/O and processing cards (not hot-swappable)
  • Hot swappable dual-redundant power supplies
Noise Level

Max 51.3 dB avg. Fans at 100%.

As low as 34 dB with low fanspeed

Fan speed is software managed based on operating temperature.

Reference ISO 7779

Dimensions
  • Height: 13.26 cm / 5.22" - 3 RU rack mount
  • Width: 43.2 cm / 17" without chassis handles, 48.3 cm / 19" with chassis handles attached
  • Depth: 54 cm / 21.33" overall
Weight
23 kg / 50 lbs
Power
Input power: 100-240Vac, 50/60Hz, 8.8A (x2), 826 Watt
Ships with single power supply.  Optional Dual-redundant, hot-swappable power supplies; available as upgrade.
Environmental temperature
0-40° C (32-104° F)
Environmental humidity

0-95% non-condensing (non-operating)
0-85% non-condensing (operational)

Warranty
3 years parts and labor

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